Description
Rugged & Versatile
Intel® Embedded Coffee Lake Xeon® & Core-I Model
- Alternative module support,e.g PoE, COM, DisplayPort, DIDO, etc.
- Fanless design
- Sealed enclosure
- Wide voltage DC input
- Wireless option
- Wide operating temperature


MB1-10AP
Fanless Embedded System with Intel® Apollo Lake N3350 / N4200 Processor (up to 2.5 GHz)

Powerful Apollo Lake Processor
- N4200 (2M Cache, up to 2.5 Ghz, TDP 6W)
- N3350 (2M Cache, up to 2.4 Ghz, TDP 6W)
1.48X Performance Improvement
(CPU Passmark)

Power Consumption Reduction


Lower Power Consumption Fanless Thermal
Design for Less Environmental Impact
Support 3 Ports LAN and 2 w/ PoE+ options
- Total supports 3 x Giga LAN
- 2 x LAN supports 802.3af and 802.3at PoE

Versatile Xpansion Modules
- Support HDMI + VGA, DVI, or DisplayPort
- Support power COM port &Digital I/O for iIoT application

MS-01VGA-D10

VGA Port Expansion Module
MS-01DVI-D10

DVI-D Port Expansion Module
MS-01DPN-D10

DisplayPort Expansion Module
MS-02COM-D10

Expansion Module with 2 x RS232 / 422 / 485 (support power 5V/12V)
MS-08DIO-T10

Expansion Module with 8-bit Isolated DIDO (4 x DI, 4 x DO)
Edge AI Accelerator
Intel® Movidius™ Myriad™ X for Edge AI
MB1-10AP with AI modules powered by Intel® Movidius™ Myriad™ X creates the possibility to be implemented in more Edge AI solutions, for example, traffic flow monitoring and real-time decision, manufacturing yield rate improvement via AI algorithm, remote healthcare service, and efficient transportation.


Support Flexible Configuration For Dual Display
- Support HDMI as primary display
- Support secondary display (DisplayPort, DVI-D, or VGA) with Xpansion module options
- Increase the flexibility to aim at target markets

Advanced Power Protection

-25~70oC Wide Temperature
MB1-10AP is designed in patented aluminum enclosure not only for aesthetic appearance but also for fan-less application in extreme temperature condition from -25℃ to 70℃.

Extreme Shock & Vibration Resistance
Shock Resistance
Operating, 50 Grms, Half-sine 11 ms Duration
(w/ SSD, according to IEC60068-2-27)
Vibration Resistance
Operating, 5 Grms, 5-500 Hz, 3 Axes
(w/ SSD, according to IEC60068-2-64)

Clear Installation Design




I/O Interface

Dimension (mm)


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